Intel Corporation today announced it has become the first company to reach an important milestone in the development of 45 nanometer (nm) logic technology. Intel has produced what are believed to be the first fully functional SRAM (Static Random Access Memory) chips using 45nm process technology, its next– generation, high–volume semiconductor manufacturing process.
Achieving this milestone means Intel is on track to manufacture chips with this technology in 2007 using 300mm wafers, and continues the company’s focus on pushing the limits of Moore’s Law, by introducing a new process generation every two years.
Today, Intel leads the industry in volume production of semiconductors using 65nm process technology, with two manufacturing facilities making 65nm chips in Arizona and Oregon and two more coming online this year in Ireland and Oregon.
“Being first to high volume with 65nm process technology and the first with a working 45nm chip highlights Intel’s leadership position in chip technology and manufacturing,” said Bill Holt, vice president, general manger, Intel Technology and Manufacturing Group in the press release. “Intel has a long history of translating technology leaps into tangible benefits that people appreciate. Our 45nm technology will provide the foundation for delivering PCs with improved performance–per– watt that will enhance the user experience.”
Intel’s 45nm process technology will allow chips with more than five times less leakage power than those made today. This will improve battery life for mobile devices and increase opportunities for building smaller, more powerful platforms.
The 45nm SRAM chip has more than 1 billion transistors. Though not intended as an Intel product, the SRAM demonstrates technology performance, process yield and chip reliability prior to ramping processors and other logic chips using the 45nm manufacturing process. It is a key first step in the march toward high–volume manufacturing of the world’s most complex devices.
In addition to the manufacturing capabilities of its D1D facility in Oregon, where the initial 45nm development efforts are underway, Intel has announced two high–volume fabs under construction to manufacture chips using the 45nm process technology: Fab 32 in Arizona and Fab 28 in Israel.
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Wake me up when they reach the Planck length
Mayhap Steve saw this development on the “roadmap” ?
When they reach the Planck length, we should be able to watch scientists tag plankton in the Discovery channel. I can hardly wait.
hey! the largest intel high volume plant is in Rio Rancho, New Mexico! what’s with all the inacurrate info!
Smaller Fabs= more yield= lower cost per unit. If RAM can come down more in price, we will begin to see ‘Instant On’ (not awake from sleep) Laptops that will boot like a PDA in the not too distant future among other things.
Semiconductors – Bah humbug. I want CPUs built on fully conductive materials (alias super conductor), and I want them now, or at least in the next two years.
Seriously, why is the planet not pushing forward with so-called super conductor tecnology, not just research, but incorporating SC into everything that runs electrical current, espcecially medium and low current devices, like CPUs?
———-The silence is deafening…———-
Less is more
Nah, I’m just looking forward to watching Intel having to increase the size of the transistors and use more power to obtain greater efficiency.
11-dimensional processors. They might even be powerful enough for Vista.
Then again, maybe not. Note from Steve Ballmer to all quantum physicists. “WE NEED MORE DIMENSIONS” <sound of chair hitting wall>
2010 Press Release from Intel—-
Intel announced today the introduction of the world’s first -25mm chip using the company’s new Isoleaner and Parallel Universe™ technology.
“This new chip is the next logical step toward the future.” said the bearded “Spock” spokesman for the Alliance, “It is the natural progression in Moore’s Law.”
Peabody, millions are being spent, here and abroad, on superconductivity. It is a tough nut, much like fusion.
You ask why we aren’t using super conductors more as if all we have to do is just plop them in our devices. The highest temperature super conductor loses it’s conductivity at -135 degrees C. This is important because it is above the temperature of liquid nitrogen, allowing them to use that substance as a coolant, instead of liquid helium which is more expensive but it’s still not practical for use in electronics. Maybe it could be used in small areas of our power grid where huge amounts of voltage are lost, but I don’t know if there are any places where enough voltage is lost in a small enoug area to warrant the cost. My guess is that because we haven’t done it, that means no.
The tech will make huge changes in the world but until we discover a material that is a super conductor at normal tempuratures it’s scope is very limited.
Mr. Peabody – “Semiconductors – Bah humbug. I want CPUs built on fully conductive materials (alias super conductor), and I want them now, or at least in the next two years.”
Consider the difficulty Apple had in incorporating simple liquid cooling in the G5 Powermacs. Now imagine them trying to put in a -135ºC freezer. Consider, also, the energy required to reach that temperature. Ain’t hapnin’. You’re talking Buck Rogers stuff. Two years? Not.